IEC 62258-2:2011
Current
The latest, up-to-date edition.
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
25-05-2011
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals and usage
6 DDX file format and file format rules
7 DDX file content
8 Definitions of DEVICE block parameters
Annex A (informative) - An example of a DDX DEVICE block
Annex B (informative) - Groups and Permutation
Annex C (informative) - A Typical CAD view from the DDX file
block example given in Annex A
Annex D (informative) - Properties for Simulation
Annex E (informative) - TERMINAL and TERMINAL_TYPE
graphical usage for CAD/CAM systems
Annex F (informative) - Cross-reference with IEC 61360-4
Annex G (informative) - Notes on VERSION and NAME
parameters
Annex H (informative) - Notes on WAFER parameters
Annex I (informative) - Additional notes
Annex J (informative) - DDX Version history
Annex K (informative) - Parse Control
IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.
This publication is to be read in conjunction with IEC 62258-1:2009.
| Committee |
TC 47
|
| DevelopmentNote |
To be read in conjunction with IEC 62258-1. (06/2005) Stability Date: 2015. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
146
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 62258-2 : 2011 | Identical |
| NBN EN 62258-2 : 2011 | Identical |
| NEN EN IEC 62258-2 : 2011 | Identical |
| I.S. EN 62258-2:2011 | Identical |
| PN EN 62258-2 : 2011 | Identical |
| CEI EN 62258-2 : 2012 | Identical |
| EN 62258-2:2011 | Identical |
| DIN EN 62258-2:2011-12 | Identical |
| UNE-EN 62258-2:2011 | Identical |
| BS EN 62258-2:2011 | Identical |
| CEI CLC/TR 62258-7 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| 06/30123954 DC : DRAFT MAR 2006 | |
| BS EN 62258-5:2006 | Semiconductor die products Requirements for information concerning electrical simulation |
| 04/30110525 DC : DRAFT MARCH 2004 | IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| IEC TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| CLC/TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| 06/30146849 DC : DRAFT FEB 2006 | IEC TR 62258-7 - SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| CLC/TR 62258-4:2013 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| EN 62258-5 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| S.R. CLC/TR 62258-4:2013 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012 (EQV)) |
| 05/30130553 DC : DRAFT MAR 2005 | IEC 62258-5 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
| PD IEC/TR 62258-4:2007 | Semiconductor die products Questionnaire for die users and suppliers |
| S.R. TR 62258-7:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| I.S. EN 62258-5:2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| CEI CLC/TR 62258-8 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| CEI EN 62258-5 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| PD CLC/TR 62258-4:2013 | Semiconductor die products Questionnaire for die users and suppliers |
| CEI CLC/TR 62258-4 : 2013 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| PD IEC/TR 62258-7:2007 | Semiconductor die products XML schema for data exchange |
| IEC TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| S.R. TR 62258-4:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| PD IEC/TR 62258-8:2008 | Semiconductor die products EXPRESS model schema for data exchange |
| 05/30130559 DC : DRAFT MAR 2005 | IEC 62258-6 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| CLC/TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| BS PD IEC TR 62258-3 : 2005 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| 05/30127455 DC : DRAFT JAN 2005 | IEC 62258-4 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| BS EN 62258-6:2006 | Semiconductor die products Requirements for information concerning thermal simulation |
| CEI EN 62258-6 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| I.S. EN 62258-6:2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| S.R. CLC/TR 62258-8:2008 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| EN 62258-6 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| IEC 61360-4:2005 | Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| ISO 6093:1985 | Information processing Representation of numerical values in character strings for information interchange |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| ISO 10303-21:2002 | Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure |
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