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IEC TR 62866:2014

Current
Current

The latest, up-to-date edition.

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

07-05-2014

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Electrochemical migration
3 Test conditions and specimens
4 Test methods
5 Electrical tests
6 Evaluation of failures and analysis
Annex A (informative) - Life evaluation
Annex B (informative) - Measurement of temperature-humidity
Bibliography

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

DevelopmentNote
Stability Date: 2020 (11/2017)
DocumentType
Technical Report
Pages
187
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NEN NPR IEC/TR 62866 : 2014 Identical
PD IEC/TR 62866:2014 Identical
BS EN 60079-27:2008 Identical

15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-3-6:2001 Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/humidity chambers
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
MIL-HDBK-781 Revision A:1996 RELIABILITY TEST METHODS, PLANS, AND ENVIRONMENTS FOR ENGINEERING DEVELOPMENT, QUALIFICATION AND PRODUCTION
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IEC 60068-2-67:1995 Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
ISO 4677-1:1985 Atmospheres for conditioning and testing Determination of relative humidity Part 1: Aspirated psychrometer method
IPC TR 476 : A1997 ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
IEC 60068-3-5:2001 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
MIL-STD-690 Revision D:2005 Failure Rate (FR) Sampling Plans and Procedures
ASQ Z1.9:2003 (R2013) Sampling Procedures And Tables For Inspection By Variables For Percent Nonconforming
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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Hardcopy - English - French
PDF 1 User - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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