IPC 2252 : 0
Withdrawn
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DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
12-09-2023
1 GENERAL
1.1 Purpose
1.2 Scope
1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing and Materials
2.3 Society of Automotive Engineers
2.4 American Society of Mechanical Engineers
2.5 International Organization for Standardization
2.6 Reference Information
3 DESIGN CONSIDERATIONS
3.1 Initial Input
3.2 Design Options
3.3 Transmission Line Type, Materials, and
Components
3.4 Electrical Design
3.5 Mechanical Design
3.6 Preliminary Design Review
3.7 Breadboard
3.8 Prototype
3.9 Documentation
3.10 Final Design Review
4 DOCUMENTATION REQUIREMENTS
4.1 Design Features Listing
4.2 Master Drawing
4.3 Master Pattern
5 MATERIALS
5.1 Microwave Printed Circuit Board Materials
5.2 Bonding Films
5.3 Metals
5.4 Conformal Coating
6 ELECTRICAL CHARACTERISTICS
6.1 Stripline
6.2 Asymmetric Stripline
6.3 Microstrip
7 DETAILED BOARD REQUIREMENTS
7.1 Machined Features
7.2 Imaging
7.3 PTFE Activation
7.4 Metallization
7.5 Etching
7.6 Bonding
7.7 Multiple Material Multilayers
7.8 Testing
8 DEVICE ATTACHMENTS AND PACKAGING
8.1 Attaching the Circuit to the Housing
8.2 Connector Attachment
8.3 Device Attachment
9 QUALITY ASSURANCE
9.1 Quality Conformance Evaluations
9.2 Reliability
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