Customer Support: 131 242

  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

IPC 6017 : 0

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES
Available format(s)

Hardcopy

Superseded date

11-12-2021

Language(s)

English

1 SCOPE
  1.1 Statement of Scope
  1.2 Purpose
  1.3 Performance Classification
  1.4 Embedded Passive Device Categories
  1.5 Documentation Hierarchy
  1.6 Selection for Procurement
  1.7 Selection (Default)
  1.8 Terms and Definitions
      1.8.1 As Agreed Upon Between User and Supplier
            (AABUS)
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Underwriters Laboratories
3 REQUIREMENTS
  3.1 General
  3.2 Materials
      3.2.1 Rigid Laminates
      3.2.2 Flexible Films
      3.2.3 Microwave High Speed Materials
      3.2.4 Bonding Materials
      3.2.5 Resistor Materials
      3.2.6 Capacitor and Capacitance Materials
      3.2.7 Metal Foils
      3.2.8 Metallic Plating and Coatings
      3.2.9 Solder Mask
      3.2.10 Polymer Coatings for Embedded Passive Devices
      3.2.11 Marking Inks
      3.2.12 Other Materials
  3.3 Visual Examination
  3.4 PB Dimensional Requirements
  3.5 Embedded Passive Pattern Definition
      3.5.1 Size Verification
      3.5.2 Spacing
      3.5.3 Conductive Surfaces
       3.5.4 Nicks and Pinholes
  3.6 Structural Integrity
       3.6.1 Thermal Stress
       3.6.2 Microsection Integrity
  3.7 Protective Coverage
       3.7.1 Solder Mask Coverage Requirements
       3.7.2 Other Protective Coatings
  3.8 Electrical Requirements
       3.8.1 Electrical Requirements of Embedded
             Passives Devices in PBs
       3.8.2 Dielectric Withstanding Voltage
       3.8.3 Circuitry
       3.8.4 Moisture and Insulation Resistance (MIR)
  3.9 Cleanliness
  3.10 Special Requirements
       3.10.1 Heat Dissipation
       3.10.2 Thermal Shock
  3.11 Repair
4 QUALITY ASSURANCE PROVISIONS
  4.1 General
  4.2 Acceptance Tests
       4.2.1 C=0 Zero Acceptance Number Sampling Plan
       4.2.2 Referee Tests

Specifies qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.

DevelopmentNote
Included in IPC C 105, IPC C 1000 & IPC 6010 SERIES. (05/2016)
DocumentType
Standard
Pages
20
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL

View more information
$218.53
Including GST where applicable

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Need help?
Call us on 131 242, then click here to start a Screen Sharing session
so we can help right away! Learn more