IPC 6018 : B

Superseded

View Superseded by

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

04-03-2022

Language(s)

English

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PACKAGING
6 NOTES
APPENDIX A - Space and Military Avionics Class 3/A
Performance Requirement

Includes end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

DevelopmentNote	Supersedes IPC 6018/IPC HF 318. To be read in conjunction with IPC 6011. (07/2002) Included in IPC 6010 SERIES, IPC C 105 & IPC C 1000. (07/2008) B2011 Edition is available in Chinese languages, See separate record. Supersedes IPC 6016. ADDENDUM 16 is available Separately, See separate record IPC 6018CS. (08/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	56
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 6018CS : 2016 IPC-6018C:2016
Supersedes	IPC 6018/IPC HF 318 : B IPC 6018 : A IPC 6016 : 0

BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2251 : 0	DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
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IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC SM 840 CHINESE : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 4553 CHINESE : A	SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 2141 : A	DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
13/30295427 DC : 0	BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
NASA STD 5005 : 2013	STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
NASA KSC DE 512-SM : 2012	FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
IPC 4554 : 0	SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IEC PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC PAS 62293:2001	Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
PD IEC/PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials