1 SCOPE
2 APPLICABLE DOCUMENTS
3 DEFINITIONS OF STRUCTURES AND TERMS
  3.1 Structures
  3.2 Terms and Definitions
  3.3 Design
  3.4 Manufacturing
  3.5 Testing and Inspection
4 TEST METHODS FOR BUILD-UP/HDI MATERIALS
  4.1 Coefficient of Thermal Expansion - Thermomechanical
      Analyzer
  4.2 Mechanical Properties
  4.3 Water Absorption Property
  4.4 Drying Property
  4.5 Ionic Impurity
  4.6 Flexibility
  4.7 Dielectric Constant
5 TEST METHOD FOR BUILD-UP PRINTED BOARDS
  5.1 Coefficient of Thermal Expansion (CTE)
  5.2 Water Absorption Property
  5.3 Drying Property
  5.4 Ionic Impurity
  5.5 Characteristic Impedance
  5.6 Flatness
6 TEST METHOD FOR G BUILD-UP PRINTED BOARD
  6.1 Peel Strength of Conductor Layer
  6.2 Pull-Off Strength of Pads
  6.3 Thermal Resistance Test for Packaging Build-Up
      Printed Boards
7 RELIABILITY TEST METHODS
  7.1 Thermal Shock Test (in Air)
  7.2 Bias Test at High Temperature and High Humidity
  7.3 High Temperature Shelf Test
8 DESIGN EXAMPLE
9 DESCRIPTION (CONTINUED DISCUSSION ITEMS/BACKGROUND OF
  DEVELOPING JPCA STANDARD FOR BUILD-UP PRINTED BOARDS
  9.1 Test Pattern
  9.2 Description of Accelerated Test