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ISO 16531:2013

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Surface chemical analysis Depth profiling Methods for ion beam alignment and the associated measurement of current or current density for depth profiling in AES and XPS

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

22-10-2020

Language(s)

English

Published date

16-05-2013

ISO 16531:2013 specifies methods for the alignment of the ion beam to ensure good depth resolution in sputter depth profiling and optimal cleaning of surfaces when using inert gas ions in Auger electron spectroscopy and X-ray photoelectron spectroscopy. These methods are of two types: one involves a Faraday cup to measure the ion current; the other involves imaging methods. The Faraday cup method also specifies the measurements of current density and current distributions in ion beams. The methods are applicable for ion guns with beams with a spot size below ~1 mm in diameter. The methods do not include depth resolution optimization.

DevelopmentNote
Supersedes ISO/DIS 16531. (05/2013)
DocumentType
Standard
Pages
18
PublisherName
International Organization for Standardization
Status
Withdrawn
SupersededBy

Standards Relationship
BS ISO 16531:2013 Identical

PD ISO/TR 18196:2016 Nanotechnologies. Measurement technique matrix for the characterization of nano-objects
ISO/TR 18196:2016 Nanotechnologies — Measurement technique matrix for the characterization of nano-objects

ISO 18115-1:2013 Surface chemical analysis — Vocabulary — Part 1: General terms and terms used in spectroscopy
ISO 14606:2015 Surface chemical analysis — Sputter depth profiling — Optimization using layered systems as reference materials

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