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ISO 9454-2:1998

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by
withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Soft soldering fluxes Classification and requirements Part 2: Performance requirements
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

16-11-2020

Language(s)

English, French

Published date

20-08-1998

Publisher

International Organization for Standardization

DocumentType
Standard
Pages
7
PublisherName
International Organization for Standardization
Status
Withdrawn
SupersededBy

DIN EN 16125:2016-03 LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
I.S. 820:2010 NON-DOMESTIC GAS INSTALLATIONS
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
I.S. EN IEC 61190-1-3:2018 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
DIN EN 1775:2007-10 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
I.S. EN 1775:2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
15/30318681 DC : 0 BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
NF ISO 26842-1 : 2009 ADHESIVES - TEST METHODS FOR THE EVALUATION AND SELECTION OF ADHESIVES FOR INDOOR WOOD PRODUCTS - PART 1: RESISTANCE TO DELAMINATION IN NON-SEVERE ENVIRONMENTS
BS EN 61190-1-2:2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
05/30133283 DC : DRAFT MAY 2005 IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
I.S. EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
BS EN 16125:2015 LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase
NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
UNE-EN 16125:2016 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase
UNI EN 1775 : 2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
05/30133287 DC : DRAFT MAY 2005 IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
I.S. EN 16125:2015 LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG IN LIQUID PHASE AND VAPOUR PRESSURE PHASE
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 1775:2007 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
EN 16125:2015 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase
10/30227098 DC : 0 BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
12/30258438 DC : 0 BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
BS EN 1775:2007 Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
UNE-EN 16125:2020 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase

ISO 9455-10:2012 Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
ISO 9455-11:2017 Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues
ISO 9455-15:2017 Soft soldering fluxes — Test methods — Part 15: Copper corrosion test
ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
ISO 9455-12:1992 Soft soldering fluxes Test methods Part 12: Steel tube corrosion test
ISO 9455-9:1993 Soft soldering fluxes Test methods Part 9: Determination of ammonia content
ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
ISO 9455-3:1992 Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods
ISO 9455-8:1991 Soft soldering fluxes — Test methods — Part 8: Determination of zinc content
ISO 9455-14:2017 Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
ISO 9455-13:2017 Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering
ISO 9455-5:2014 Soft soldering fluxes Test methods Part 5: Copper mirror test
ISO 9455-6:1995 Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content

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Hardcopy - English
PDF 1 User - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
Hardcopy - French
PDF 1 User - French
PDF 3 Users - French
PDF 5 Users - French
PDF 9 Users - French
Hardcopy - English
PDF 1 User - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
Hardcopy - French
PDF 1 User - French
PDF 3 Users - French
PDF 5 Users - French
PDF 9 Users - French
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