IPC J STD 001 SPANISH : F

Superseded

View Superseded by

REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

Available format(s)

Hardcopy

Superseded date

05-02-2021

Language(s)

Spanish, Castilian

Publisher

Institute of Printed Circuits

Este estandar establece las prácticas y requerimientos para la manufactura de soldaduras electricas y ensambles electronicos. Historicamente, estandares de ensamble electronico (soldadura) contienen material más comprensivo dirigido a los principios y técnicas. Para un entendimiento más completo de las recomendaciones y requerimientos de este documento, uno puede usar lo en conjunto con el IPC-HDBK-001, IPC-A-610 y el IPC-HDBK-610.

DocumentType	Standard
Pages	88
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC-J-STD-001G SPANISH:2017
Supersedes	IPC J STD 001 SPANISH : E

IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 6011 : 0	GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC HDBK 001 : E	HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
IPC 7530 : 0	GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
ESD S20.20 : 2014	PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 9691 : A	USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 7711/21 : B	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 9201 : A	SURFACE INSULATION RESISTANCE HANDBOOK
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 817 : A	GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IPC 6013 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 9202 : 0	MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
IPC 9203 : 0	USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
IPC 9261 : A	IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
IPC 2223 : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC SM 785 : 0	GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK