|
DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
|
|
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
|
|
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
|
|
IEC PAS 63015:2016
|
Definition of "Low-Halogen" for electronic products
|
|
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK
|
|
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
|
|
IPC 1601 GERMAN : -
|
PRINTED BOARD HANDLING AND STORAGE GUIDELINES
|
|
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
|
|
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
|
|
IPC J STD 006 CHINESE : B-2
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
|
|
IPC 8701 : 0
|
FINAL ACCEPTANCE CRITERIA STANDARD FOR PV MODULES-FINAL MODULE ASSEMBLY
|
|
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
|
|
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
|
|
PD IEC/TS 62564-1:2016
|
Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors
|
|
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
|
|
MIL-DTL-39032 Revision E:2000
|
RESISTORS, PACKAGING OF
|
|
PD IEC/TS 62647-1:2012
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
|
|
IEC PAS 62647-23:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
|
|
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
|
|
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
|
|
GEIA STD 0006 : 2008
|
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
|
|
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
|
|
NASA JSC 66491 : 2013
|
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
|
|
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
|
|
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
|
|
IEC PAS 62686-2:2016
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
|
|
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
|
|
IEC TS 62686-1:2015
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
|
|
IEC TS 62564-1:2016
|
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
|
|
IEC TS 62647-23:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
|
|
PD IEC/PAS 62686-2:2016
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components
|
|
PD IEC/TS 62647-23:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
|
|
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
|
|
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
|
|
PD IEC/PAS 63015:2016
|
Definition of “Low-Halogen?? for electronic products
|
|
PD IEC/TS 62686-1:2015
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
|
|
12/30262664 DC : DRAFT APR 2012
|
BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
|
|
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
|
|
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
|
|
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
|
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