NASA GSFC STD 8002 : 2015
Current
The latest, up-to-date edition.
01-01-2015
DOCUMENT HISTORY LOG
FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. ACRONYMS AND DEFINITIONS
4. REQUIREMENTS
5. GUIDANCE
APPENDIX A - Examples of Percent Voiding In Chip Package
Solder Joints
APPENDIX B - Water Soluble Flux Initial Qualification
Reports Checklist
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