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NASA GSFC STD 8002 : 2015

Current
Current

The latest, up-to-date edition.

STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
Published date

01-01-2015

DOCUMENT HISTORY LOG
FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. ACRONYMS AND DEFINITIONS
4. REQUIREMENTS
5. GUIDANCE
APPENDIX A - Examples of Percent Voiding In Chip Package
             Solder Joints
APPENDIX B - Water Soluble Flux Initial Qualification
             Reports Checklist

Sets up the requirements applicable to soldering processes for Printed Wiring Assemblies (PWAs) that use Water Soluble Flux (WSF).

DevelopmentNote
Expiration Date: 03-09-2020. (09/2015)
DocumentType
Standard
PublisherName
National Aeronautics and Space Administration
Status
Current

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