NASA KSC STD E 0010 : 1994
Current
The latest, up-to-date edition.
01-01-1994
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 Governmental
2.1.1 Specifications
2.1.2 Standards
2.1.3 Documents
2.2 Non-Governmental
3 REQUIREMENTS
3.1 Documentation Requirements
3.2 Personnel Training
3.3 Personnel Qualifications
3.4 Facilities
3.5 Environmental Conditions
3.6 Tools and Equipment
3.7 Materials
3.7.1 Solder
3.7.2 Flux
3.7.3 Cleaning Agents
3.7.4 Cleaning Agents Selection
3.8 Preparation for Soldering
3.8.1 Insulation Removal
3.8.2 Wire Lay
3.8.3 Tinning of Stranded Conductors
3.8.4 Wicking
3.8.5 Solid Hookup Wire
3.8.6 Stress Relief
3.8.7 Mechanical Support
3.8.8 Mechanical Splices
3.9 Mounting of Glass Encased Components
3.10 Lead Bending Requirements
3.11 Attachment of Conductors to Terminals
3.11.1 Insulation Clearance
3.11.2 Turret and Straight Pin Terminals
3.11.3 Bifurcated Terminals
3.11.4 Hook or Pierced Terminal
3.11.5 Solder Cups
3.11.6 Insulation Tubing Application
3.11.7 Cordwood Termination
3.12 Soldering of Terminals
3.12.1 Cup Terminals
3.12.2 Hook or Pierced Terminals
3.12.3 Wicking
3.12.4 Terminals Mounted on Bus Bars or Printed Circuits
3.13 Removal of Flux and Impurities
3.14 Printed Circuit Boards
3.14.1 Component Leads
3.14.2 Splicing
3.14.3 Soldering
3.14.4 Eyelets, Tubelets, and Plated Through Holes
3.15 Characteristics of Acceptable Solder Connections
3.16 Soldering Process Waste Disposal
4 QUALITY ASSURANCE PROVISIONS
4.1 Inspection Requirements
4.1.1 Acceptance Criteria
4.1.2 Rejection Criteria
4.2 Rework
5 PREPARATION FOR DELIVERY
6 NOTES
6.1 Intended use
6.2 Ordering Data
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