Customer Support: 131 242

  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

NBN EN 61192-4 : 2004

Current
Current

The latest, up-to-date edition.

WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
Published date

12-01-2013

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection technique
   4.4 Interpretation of requirements
5 Process characterization
   5.1 Wire preparation processes
   5.2 Terminal mounting processes
   5.3 Soldering terminal
   5.4 Solderability
   5.5 Preconditioning
   5.6 Mechanical securing
6 Wire preparation attributes
   6.1 Insulation stripping
   6.2 Twisted strands
7 Connector pins and terminals
   7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
   8.1 Wire selection
   8.2 Wire routing
   8.3 Staking
   8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
   10.1 Post terminations
Figures
Table

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

DocumentType
Standard
PublisherName
Belgian Standards
Status
Current

Standards Relationship
DIN EN 61192-4:2003-11 Identical
EN 61192-4:2003 Identical
BS EN 61192-4:2003 Identical
I.S. EN 61192-4:2003 Identical

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Need help?
Call us on 131 242, then click here to start a Screen Sharing session
so we can help right away! Learn more