NEN EN IEC 61189-3 : 2008
Current
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
Published date
12-01-2013
Publisher
Defines methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
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