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NF ISO 5725-2 : 1994
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APPLICATION OF STATISTICS - ACCURACY (TRUENESS AND PRECISION) OF MEASUREMENT METHODS AND RESULTS - PART 2: BASIC METHOD FOR THE DETERMINATION OF REPEATABILITY AND REPRODUCIBILITY OF A STANDARD MEASUREMENT METHOD
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HD 323.2.20 : 200S3
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
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IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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NF EN 61189-6 : 2008
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
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NF EN 61190-1-2 : 2014
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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NF EN 61249-2-7 : 2002
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
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IEC 61249-2-7:2002
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Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
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NF EN 61190-1-1 : 2002
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
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ISO 9455-2:1993
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Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
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IEC 61189-1:1997+AMD1:2001 CSV
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IEC 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
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NF EN 61189-3 : 2013
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
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IEC 62137:2004
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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NF EN ISO 9455-2 : 1995
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SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD
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|
ISO 9455-1:1990
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Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
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IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
|
|
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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|
NF EN 60068-1 : 2014
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
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|
NFC 20 720 : 87 AMD 1 1988
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
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|
NF EN 61190-1-3 : 2008 AMD 1 2010
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Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
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|
ISO 5725-2:1994
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Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
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|
ISO 9001:2015
|
Quality management systems — Requirements
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NF EN 2199455-1 : 1994
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SOFT SOLDERING FLUXES - TEST METHODS - PART 1: DETERMINATION OF NON-VOLATILE MATTER, GRAVIMETRIC METHOD
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|
NF EN 62137 : 2005
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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
|
|
NF EN ISO 9001 : 2015
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QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
|
|
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
|
|
NF EN 61189-1 : 98 AMD 1 2002
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
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