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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
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Published date: 12-01-2013
Publisher: Association Francaise de Normalisation
AVANT-PROPOS INTRODUCTION 1 Domaine d'application 2 Références normatives 3 Termes et définitions 4 Exigences générales 4.1 Classification 4.2 Contradiction 4.3 Techniques de controle 4.4 Interprétation des exigences5 Processus de préparation des composants 5.1 Formation des sorties 5.2 Avancée et rivetage des sorties 5.3 Découpage I éboutage des sorties 5.4 Préétamage 6 Attributs de masquage 6.1 Désalignement 6.2 Mauvaise adhérence 6.3 Capacité thermique 7 Insertion des composants à trous traversants 7.1 Exigences d'ordre général 7.2 Critères d'orientation et de montage 7.3 Composant manquant 7.4 Mauvais composant 7.5 Composant endommagé 8 Attributs du processus de brasage 8.1 Exigences d'ordre général 8.2 Désalignement 8.3 Composants endommagés 8.4 Caractéristiques des joints brasés9 Attributs de nettoyage 9.1 Résidus de flux 9.2 Autres résidus 10 Attributs de retouchelremplacementAnnexe ZA (normative) - Références normatives à d'autres publications internationales avec les publications européennes correspondantes
Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
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