PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C

Published date

12-01-2013

Publisher

Association Francaise de Normalisation

AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Composant pour l'agrément de savoir-faire (CQC)
4 Agrément de savoir-faire
5 Démonstration du savoir-faire
6 Carte de démonstration du savoir-faire (CTB)
Figures
Annexes
A Acronymes relatifs à l'IECQ et leur explication
B Tableau de conversion
C Bibliographie
ANNEXE ZA Autres publications internationales citées dans la
présente norme avec les références des publications
européennes correspondantes

La présente spécification particulière d'agrément (Cap DS) est basée sur la CEI 2326-4. Elle concerne les cartes imprimées multicouches rigides avec connexions transversales.

DevelopmentNote	Indice de classement: C93-708-1. (11/2003)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
EN 62326-4-1:1997	Identical
IEC 62326-4-1:1996	Identical

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
NFC 20 723 : LATEST
IEC 60249-3-3:1991	Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 62326-1:2002	Printed boards - Part 1: Generic specification
IEC 62326-4:1996	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 60068-2-38:2009	Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
HD 323.2.3 : 200S2	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
IEC 60068-2-3:1969	Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
NFC 20 720 : 87 AMD 1 1988	BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
HD 323.2.38 : 200S1	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST