SN EN 60068-2-58 : 1999
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
12-01-2013
1 Scope and object
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes using lead-free solder
alloys
5 Preconditioning
6 Solder bath method
6.1 Test apparatus and materials for the solder bath
method
6.2 Test procedure for solder bath method
7 Solder reflow methods
7.1 Test apparatus and materials for solder reflow
methods
7.2 Test procedure for the solder reflow method
8 Test conditions
8.1 Test conditions for lead-free solder alloys
8.2 Test conditions for lead containing solder alloy
9 Final measurements
9.1 Flux removal
9.2 Recovery conditions
9.3 Evaluation
10 Information to be given in the relevant specification
Annex A (normative) Criteria for visual examination
Annex B (informative) Guidance
Annex C (informative) Quick view of the test conditions
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
Figures
Tables
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