We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
  • SN EN 61192-3 : 2003

    Current The latest, up-to-date edition.
    Add to Watchlist
    This Standard has been added successfully to your Watchlist
    Please visit My Watchlist to see all standards that you are watching.
    Please log in or to add this standard to your Watchlist.
    We could not add this standard to your Watchlist.
    Please retry or contact support for assistance.
    We could not add this standard to your Watchlist.
    Please retry or contact support for assistance.
    You have already added this standard to your Watchlist.
    Visit My Watchlist to view the full list.


    Available format(s): 


    Published date:  12-01-2013

    Publisher:  Swiss Standards

    Add to Watchlist

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection techniques
       4.4 Interpretation of requirements
    5 Component preparation processes
       5.1 Lead forming
       5.2 Lead protrusion and clinching
       5.3 Lead cutting/cropping
       5.4 Pre-tinning
    6 Masking attributes
       6.1 Misalignment
       6.2 Improper adhesion
       6.3 Thermal capability
    7 Insertion of through-hole components
       7.1 General requirements
       7.2 Orientation and mounting criteria
       7.3 Missing components
       7.4 Wrong components
       7.5 Damaged components
    8 Soldering process attributes
       8.1 General requirements
       8.2 Misalignment
       8.3 Damaged components
       8.4 Solder joint characteristics
    9 Cleaning attributes
       9.1 Flux residues
       9.2 Other residues
    10 Rework/replacement attributes
    Annex ZA (normative) Normative references to international
             publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Swiss Standards
    Status Current
    • Access your standards online with a subscription


      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective
Need help?
Call us on 131 242, then click here to start a Screen Sharing session
so we can help right away! Learn more