Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

10-04-2018

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.04, 2018 Defines the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.

1.1These test methods cover the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.

1.2The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.4This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Committee	F 01
DocumentType	Test Method
Pages	3
ProductNote	Reconfirmed 2018
PublisherName	American Society for Testing and Materials
Status	Current
Supersedes	ASTM F 219 : 1996 : R2013

ASTM F 72 : 2021	Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
ASTM F 73 : 1996 : R2017	Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
ASTM F 288 : 1996 : R2019	Standard Specification for Tungsten Wire for Electron Devices and Lamps
ASTM F 487 : 2013 : R2018	Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
ASTM F 289 : 1996 : R2019	Standard Specification for Molybdenum Wire and Rod for Electronic Applications

ASTM B 63 : 1990 : R1995 : EDT 1	Standard Test Method for Resistivity of Metallically Conducting Resistance and Contact Materials
ASTM F 16 : 2012 : R2022	Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps (Withdrawn 2023)
ASTM F 289 : 1996	Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 16 : 2012 : R2017	Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
ASTM B 63 : 2007 : R2018	Standard Test Method for Resistivity of Metallically Conducting Resistance and<brk/> Contact Materials
ASTM B 63 : 2007	Standard Test Method for Resistivity of Metallically Conducting Resistance and Contact Materials
ASTM D 374 : 1999	Standard Test Methods for Thickness of Solid Electrical Insulation

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ASTM F 219 : 1996 : R2018

Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023)

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