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ASTM F 3192 : 2016

Current
Current

The latest, up-to-date edition.

Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

18-10-2016

CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

1.1This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

1.2Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.

1.2.1Purity Requirements:

1.2.1.1Metallic element impurities, and

1.2.1.2Non-metallic element impurities.

1.2.2Grain Size Requirements—Grain size.

1.2.3Inner Quality Requirements—Internal defect.

1.2.4Bonding Requirements:

1.2.4.1Backing plate, and

1.2.4.2Bonding ratio.

1.2.5Configuration Requirements:

1.2.5.1Dimension,

1.2.5.2Tolerance, and

1.2.5.3Surface roughness.

1.2.6Appearance Requirements—Surface cleanness.

1.3The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee
F 01
DocumentType
Standard
Pages
5
PublisherName
American Society for Testing and Materials
Status
Current

ASTM F 2113 : 2001 : EDT 1 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
ASTM E 1001 : 2016 : REDLINE Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM F 2405 : 2004 Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
ASTM F 1512 : 1994 : R1999 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM B 209 : 2014 Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
ASTM E 1001 : 2021 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM F 2405 : 2004 : R2011 Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)
ASTM F 2113 : 2001 : R2011 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
ASTM E 1001 : 2011 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM E 1001 : 1999 : REV A Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM F 1512 : 1994 : R2003 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM B 248 : 2017 Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
ASTM E 1001 : 2016 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM F 2113 : 2001 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
ASTM B 209 : 2014 : REDLINE Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
ASTM E 1001 : 2006 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM F 1512 : 1994 : R2011 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
ASTM E 112 : 2013 : R2021 Standard Test Methods for Determining Average Grain Size
ASTM E 112 : 2013 Standard Test Methods for Determining Average Grain Size
ASTM B 248 : 2022 Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
ASTM E 1001 : 2004 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM B 248 : 2017 : REDLINE Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
ASTM F 2113 : 2001 : R2007 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications

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