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BS 123300-003:2001

Current
Current

The latest, up-to-date edition.

System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

17-12-2001

Committees responsible
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test programme
7 Additional capability
8 Traceability
Annex A (normative) Test pattern for marking inks
Annex B (normative) Test pattern for solder masks
Annex C (normative) Test pattern for bonded heatsinks
Annex D (normative) Use of ANSI/IPC A-600F
Annex E (normative) Test method for determination of
        characteristic impedence by Time Domain
        Reflectometry (TDR)
Annex F (informative) Sample handling considerations
        for TDR
Annex G (informative) Additional information about TDR
Bibliography

Describes the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid multilayer printed boards.

This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid multilayer printed boards. It is applicable for rigid multilayer printed boards made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

Committee
EPL/501
DevelopmentNote
To be read in conjunction with BS 123000(2001) and BS 123300(2001). Supersedes 01/204157 DC. (01/2002)
DocumentType
Standard
Pages
42
PublisherName
British Standards Institution
Status
Current
Supersedes

BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
BS EN ISO 3543:2001 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
IEC 60249-2-11:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
BS 123000:2001 System of quality assessment. Generic specification. Printed boards
BS EN 60249-2-12:1994 Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
BS EN 61188-1-2:1998 Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
BS 6221-2:1991 Printed wiring boards Methods of test
BS 4584-103.1:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
BS EN ISO 1463:2004 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
BS QC 221100:1997 Radio-frequency connectors. RF coaxial connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with screw coupling. Characteristic impedance 50 ohms (Type SMA)
BS EN 60249-2-11:1994 Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
IEC 60249-2-12:1987 Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

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