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BS 123700-003:2001

Current
Current

The latest, up-to-date edition.

System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

17-12-2001

Publisher

British Standards Institution

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test program
7 Additional test capability
8 Traceability
Annex A (normative) Use of ANSI/IPC A-600F
Bibliography

Describes the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flex-rigid double-sided printed boards with through-connections.

This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flex-rigid double-sided printed boards with through-connections. It is applicable for flex-rigid double-sided printed boards with through-connections made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

Committee
EPL/501
DevelopmentNote
To be read in conjunction with BS 123000(2001) and BS 123700(2001). Supersedes 01/204165 DC. (01/2002)
DocumentType
Standard
Pages
26
PublisherName
British Standards Institution
Status
Current
Supersedes

BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections

BS EN ISO 3543:2001 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
IEC 60249-2-11:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
BS 123000:2001 System of quality assessment. Generic specification. Printed boards
BS EN 60249-2-12:1994 Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
BS EN 60249-2-13:1994 Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade
IEC 60249-2-8:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
BS 6221-2:1991 Printed wiring boards Methods of test
BS 4584-103.1:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
BS EN 60249-2-15:1994 Specifications Flexible copper-clad polyimide film, of defined flammability
BS EN 60249-2-8:1995 Specifications Specification for flexible copper-clad polyester (PETP) film
BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60249-2-15:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
BS EN ISO 1463:2004 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
IEC 60249-2-13:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS EN 60249-2-11:1994 Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
IEC 60249-2-12:1987 Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

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