BS 4584-15:1978

Withdrawn

Metal-clad base materials for printed wiring boards Adhesive coated polymeric films: PETP-F-15 and PI-F-15

Available format(s)

Hardcopy , PDF

Withdrawn date

01-07-2006

Language(s)

English

Published date

31-10-1978

Publisher

British Standards Institution

Foreword
Cooperating organizations
Specification
1 Scope
2 References
3 Materials and construction
4 Marking
5 Properties of the adhesive coated film
6 Properties of the adhesive coated film after
    lamination as a cover sheet
7 Packaging and dimensions
8 Determination of thickness
9 Lamination of adhesive coated film as a cover sheet
10 Determination of surface resistance after damp heat
    and recovery
11 Determination of permittivity and dissipation factor
    after damp heat and recovery
12 Determination of peel strength after lamination
13 Determination of peel strength after lamination and
    heat shock
14 Determination of peel strength after lamination and
    dry heat
15 Determination of dimensional stability
16 Determination of resistance to flexural fatigue
17 Determination of flammability (vertical burning test
    for flexible materials)
Tables
1 Preferred thicknesses and permitted deviations of
    polyester film
2 Preferred thicknesses and permitted deviations of
    polyimide film
3 Sizes and permitted number of inclusions
4 Properties of the adhesive coated film after
    lamination as a cover sheet
Figures
1 Examples of schematic arrangements for measuring
    peel strength
2 Fluidized sand bath
3 Location of specimens on original sheet for
    dimensional stability
4 Location of marks on specimen for dimensional
    stability test
5 Flexural fatigue test pattern
6 Flexural fatigue test
7 Fire resistant shield for flammability test
8 Arrangement of vertical burning test for flexible
    materials

Properties of films of polyester and polyimide used as cover sheets for flexible printed circuits.

Committee	EPL/501
DevelopmentNote	Supersedes 77/26427 DC (08/2005)
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Withdrawn

IEC 60250:1969	Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths
BS 2011-2.1B:1977	Environmental testing. Tests Tests B. Dry Heat
IEC 60249-3-3:1991	Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981	Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
BS 4584-10:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10
BS 3502:1967	Schedule of common names and abbreviations for plastics and rubbers.
BS 2011-2.1Ca:1977	Environmental testing. Tests Test Ca. Damp heat, steady state
BS 4584-1(1970) : LATEST
BS 4584-9:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9