BS 6493-3:1985

National foreword
Committees responsible
Chapter I: General
1. Scope and purpose
2. Object
3. Terms, definitions and letter symbols
4. Standard atmospheric conditions
5. External visual examination and verification of
     dimensions
6. Electrical measurements
Chapter II: Mechanical test methods
1. Robustness of terminations
1.1 Tensile
1.2 Bending
1.3 Torsion
1.4 Torque
2. Soldering
2.1 Solderability
2.2 Resistance to soldering heat
2.3 Resistance of plastic encapsulated SMDs to the
     combined effect of moisture and soldering heat
3. Vibration (sinusoidal)
4. Shock
5. Acceleration, steady state
6. Bond strength test
6.1 General
6.2 Methods A and B
6.3 Method C
6.4 Method D
6.5 Methods E and F
6.6 Information to be given in the relevant
     specification
7. Die shear strength test
Appendix to Sub-clause 6.2 - Guidance
Chapter III: Climatic test methods
1. Change of temperature
1.1 Rapid change of temperature: two-chamber method
1.2 Rapid change of temperature: two-fluid-bath method
2. Storage (at high temperature)
3. Low air pressure
4. Damp heat, cyclic
5A. Damp heat, steady state
5B. Damp heat, steady state, accelerated
5C. Damp heat, steady state, highly accelerated
6. Composite temperature/humidity cyclic test
7. Sealing
7.1 Bomb pressure test
7.2 Text deleted
7.3 Fine leak detection: radioactive krypton method
7.4 Fine leak detection: tracer gas method with mass
     spectrometer
7.5 Gross leak, perfluorocarbon vapour method using
     electronic detection apparatus
8. Salt mist
9. Thermal intermittence test
10. Internal moisture content measurement by mass
     spectrometry method
Chapter IV: Miscellaneous test methods
1. Flammability tests of plastic-encapsulated devices
1.1 Flammability (internally induced)
1.2 Flammability (externally induced)
2. Permanence of marking