• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

BS 9400:1970

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Specification for integrated electronic circuits and micro-assemblies of assessed quality (qualification approval procedures): generic data and methods of test
Available format(s)

Hardcopy

Superseded date

29-11-1985

Language(s)

English

Published date

15-11-1992

Cooperating organizations
Foreword
Section 1. Principles and mandatory requirements
1.1 General matters
1.1.1 Scope
1.1.2 Related documents
1.1.3 Terminology
1.1.3.1 General terms
1.1.3.2 Integrated circuits and their functions
1.1.3.3 General descriptive terms
1.1.3.4 Terms for the characteristics of digital
            circuits
1.1.3.5 Terms for the characteristics of analogue
            circuits
1.1.4 Letter symbols, signs and abbreviations
1.1.4.1 Digital circuits
1.1.5 Graphical symbols
1.1.5.1 Basic symbols shapes
1.1.5.2 Connections
1.1.6 Marking of the part and package
1.1.6.1 Terminal identification
1.1.6.2 Manufacturer's type number
1.1.6.3 Factory identification code, or manufacturer's
            name or trade-mark
1.1.6.4 Date code
1.1.6.5 Colour code identification for manufacturer's
            type number
1.1.7 Eligibility for qualification approval:
            primary stage of manufacture and sub-
            contracting
1.1.7.1 Text deleted
1.1.7.2 Semiconductor integrated circuits
1.1.8 Structurally similar integrated circuits
1.1.8.1 Electrical tests in Groups A and/or C and/or
            D (excluding electrical endurance tests)
1.1.8.2 Environment test in Groups B and/or C and/or D
1.1.8.3 Electrical endurance tests
1.1.8.4 Dimensional inspection
1.1.8.5 Accelerated tests
1.1.9 Delayed delivery
1.1.10 Supplementary procedure for qualification
            approval
1.1.10.1 Group A tests
1.1.10.2 Group D tests
1.1.11 Certified test records
1.1.12 Standard ratings and characteristics
1.1.12.1 Supply terminal voltages
1.1.12.2 Test temperatures
1.1.12.3 Preferred temperature ranges
1.1.13 Unchecked parameters
1.1.14 Procedure to be followed in the event of
            failure at Group C or D inspection
1.1.15 Ordering information
1.1.16 Release prior to completion of Group B tests
1.1.17 Supplementary procedure for reduced inspection
1.1.18 Supplementary procedure for full assessment
            level components
1.1.19 Small production lots
1.1.20 Sampling procedures
1.2 Test procedures
1.2.1 Standard conditions for testing
1.2.1.1 General
1.2.1.2 Safety aspects
1.2.1.3 Drying
1.2.2 External visual inspection
1.2.3 Dimensioning and gauging procedures
1.2.4 Electrical test procedures
1.2.4.1 General
1.2.4.2 Measurement methods:
            0001 etc. General
            1001 etc. Functional tests
            2000 etc. Digital circuits
            4000 etc. Passive networks
            5000 etc. Microwave circuits
1.2.5 Mechanical test procedures
1.2.5.1 Direction of acceleration/force
1.2.6 Environmental test procedures
1.2.6.1 Cold
1.2.6.2 Dry heat
1.2.6.3 High temperature storage
1.2.6.4 Damp heat, steady state
1.2.6.5 Damp heat cyclic
1.2.6.6 Shock
1.2.6.7 Bump
1.2.6.8 Vibration (sinusoidal)
1.2.6.8.1 Text deleted
1.2.6.8.2 Text deleted
1.2.6.9 Acceleration steady state
1.2.6.10 Mould growth
1.2.6.11 Corrosion
1.2.6.12 Low air pressure
1.2.6.13 Rapid change of temperature
1.2.6.14 Sealing
1.2.6.14.1 Fine leak detection
1.2.6.14.2 Gross leak detection
1.2.6.15 Soldering
1.2.6.15.1 Solderability
1.2.6.15.2 Resistance of components to solder heat
1.2.6.15.3 De-wetting
1.2.6.15.4 Ageing
1.2.6.16 Robustness of terminations
1.2.6.16.1 Tensile
1.2.6.16.2 Bending
1.2.6.16.3 Bending (row of terminations)
1.2.6.16.4 Push test
1.2.6.16.5 Torque
1.2.6.17 Flammability
1.2.6.17.1 Internal
1.2.6.17.2 External
1.2.6.18 Immersion in cleaning solvents
1.2.6.18.1 Resistance to contaminating fluids
1.2.6.19 Rapid change of temperature, two-bath method
1.2.6.20 Radiography
1.2.6.21 Damp heat steady state with bias
1.2.6.22 Thermal intermittance
1.2.6.23 Effects of moisture on solder glass seals
1.2.7 Electrical endurance test procedures
1.2.7.1 General
1.2.7.2 Test conditions
1.2.7.3 Specified conditions
1.2.8 Accelerated test procedures
1.2.8.1 Thermal overstress tests
1.2.8.1.1 General
1.2.8.1.2 Basic theory
1.2.8.1.3 Activation energy level
1.2.8.1.4 Integrated circuit groupings
1.2.8.1.5 Test procedure
1.2.8.1.6 Specified conditions
1.2.8.2 Text deleted
1.2.8.3 Text deleted
1.2.9 Screening test procedures
1.2.9.1 Seal testing
1.2.9.1(a) Order of procedure
1.2.9.1(b) Alternative order of procedure
1.2.9.1.1 Screening level A
1.2.9.1.2 Screening level B
1.2.9.1.3 Screening level C
1.2.9.1.4 Screening level D
1.2.9.1.5 Screening level E
1.2.9.2 Burn-in screen
1.2.9.3 Alternative die screening procedure
1.2.9.4 Special electrical screening tests
1.2.10 Internal visual inspection
1.2.10.1 Metallization defects
1.2.10.2 Diffusion and passivation defects
1.2.10.3 Die defects
1.2.10.4 Die orientation defects
1.2.10.5 Die mounting defects
1.2.10.6 Preform mounting and orientation defects
1.2.10.7 Insulation island (stand-off) mounting
            defects
1.2.10.8 Glassivation defects
1.2.10.9 Bond defects
1.2.10.10 Internal lead wires
1.2.10.11 Package conditions
1.2.10.12 Text deleted
1.2.11 Wire bond strength
1.2.12 Die shear strength
1.3 Controlled environment
1.3.1 Air cleanliness
1.3.2 Humidity
1.3.3 Temperature
1.3.4 Biological
Section 2. Rules for the preparation of detail
specifications
2.1 Basic information
2.2 Inspection requirements for full assessment
            level specifications for solid encapsulation
            (plastics) devices
2.3 Certified test records
2.4 Rules for detail specifications in the full
            assessment level
2.5 Rules for detail specifications in additional
            assessment levels S1, S2, S3, S4 and S5
2.6 Rules for detail specifications in additional
            assessment levels S11 and S12
Appendices
A. Example of a detail specification for a TTL circuit
B. List of rules for the preparation of detail
     specifications
C. Text deleted
D. Test methods for thermosetting moulding or casting
     material or the solid (primary), or secondary
     encapsulation of silicon integrated circuits
E. Approval of materials and processing for integrated
     circuits by thermal overstress tests
F. Procedure for the adoption of specifications in the
     D3000 series into the BS 9000 system

Forms part of the system of standards for electronic parts of assessed quality. Terms, definitions, test methods and other material necessary to implement fully the detail specifications for integrated electronic circuits. Included in section 2 are the general rules for preparation of detail specifications.

Committee
EPL/47
DevelopmentNote
Inactive for the new design. Supersedes 68/24470 DC, 86/23035 DC & 90/30954 DC (05/2005)
DocumentType
Standard
Pages
0
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

BS 9490:1975 Rules for the preparation of detail specifications for digital integrated circuits of assessed quality. Full assessment level
BS 6475:1984 Specification for processor system bus interface (Eurobus A)
BS CECC 90000:1991 Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits
BS 9493:1981 Rules for the preparation of detail specifications for integrated circuits of assessed quality which perform mixed digital and/or analogue functions
BS 9450:1998 Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test
BS 9430:1978 Rules for the preparation of detail specifications for integrated circuits of assessed quality: voltage regulators. Full assessment level
BS 9450:1975 Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test

PD 9004:1989 BS 9000, CECC & IECQ UK administrative guide
BS 9000(1967) : LATEST
BS 2011-2.1M:1984 Environmental testing. Tests Test M. Low air pressure
BS CECC 90000:1991 Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits
IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
BS 9300:1969 Specification for semiconductor devices of assessed quality: generic data and methods of test
BS 2011-2.1B:1977 Environmental testing. Tests Tests B. Dry Heat
BS 2782-1.141A.D(1978) : LATEST
BS 2011-2.1XA(1981) : 1981 AMD 7553 ENVIRONMENTAL TESTING - TESTS - TEST XA AND GUIDANCE - IMMERSION IN CLEANING SOLVENTS
BS 9401:1970 Rules for the preparation of detail specifications for integrated circuits of assessed quality: TTL digital gate circuits. General application category
BS 2011-2.1N:1985 Environmental testing. Tests Test N. Change of temperature
BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
BS 6493-3:1985 Semiconductor devices Mechanical and climatic test methods
BS 4727(1971) : LATEST
BS 3934:1965 Specification for dimensions of semiconductor devices and integrated electronic circuits
BS 2011(1967) : LATEST
BS 6001(1972) : AMD 5054 SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - SPECIFICATION FOR SAMPLING PLANS INDEXED BY ACCEPTABLE QUALITY LEVEL (AQL) FOR LOT - BY - LOT INSPECTION
BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering

View more information
£374.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.