Foreword
Preface and implementation
Section 1 - Scope
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred values of ratings and characteristics
2.5 Marking
2.5.1 Terminal identification
2.5.2 Type designation
2.5.3 Manufacturer's name or trade-mark
2.5.4 Date code system
2.6 Ordering information
Section 3 - Quality assessment procedures
3.1 Manufacturing stages and conditions for
        manufacturer's approval
3.2 Definition of production lot
3.3 Structurally similar devices
3.4 Qualification and capability approval procedures
3.4.1 Qualification approval procedure
3.4.2 Capability approval procedure (App. VII)
3.5 Quality conformance inspection
3.5.1 Division into Groups and Sub-groups
3.5.2 Inspection requirements
3.5.3 Supplementary procedures for reduced inspection
3.5.4 Sampling requirements for small lot or for
        expensive devices
3.5.5 Certified test records
3.5.6 Delivery of devices subjected to destructive or
        non-destructive tests
3.5.7 Delayed deliveries
3.5.8 Supplementary procedure for deliveries
3.5.9 Unchecked parameters (additional information)
3.5.10 Screening
Section 4 - Test and measurement conditions
4.1 Standard conditions for testing
4.2 Visual examination
4.2.1 Visual inspection
4.2.2 Dimensions
4.2.3 Permanence of marking (see 4.4.12)
4.3 Electrical measurements
4.3.1 Alternative methods
4.3.2 Precision of measurement
4.3.3 Measurements at high temperature
4.3.4 Methods for electrical measurements
4.4 Climatic and mechanical tests
4.4.1 Storage at high temperature
4.4.2 Damp heat, cyclic
4.4.3 Damp heat, steady state
4.4.4 Change of temperature
4.4.5 Shock
4.4.6 Vibration
4.4.7 Solderability
4.4.8 Resistance to soldering heat
4.4.9 Robustness of terminations
4.4.10 Sealing
4.4.11 Acceleration, steady state
4.4.12 Immersion in cleaning solvents
4.5 Electrical endurance tests
4.5.1 General
4.5.2 Usual test procedures
4.5.3 Accelerated test procedures
Appendices
I Structural similarity
II-A General inspection requirements for transistors
        and diodes (excluding rectifier diodes)
II-B General inspection requirements for rectifier
        diodes and transistors
III Tables of dimensions to be checked in Group B
        and Group C inspection
IV Directions of applied forces for mechanical
        tests
V Description of non-IEC methods of electrical
        measurements
VI Screening
VII Capability approval procedure