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BS EN 123400:1992

Current
Current

The latest, up-to-date edition.

Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-12-1990

Publisher

British Standards Institution

Foreword
Preface
Section 1 - Introduction
1.1 Scope and object
1.2 Related documents
Section 2 - General
Section 3 - Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
Section 4 - Relevant specification
Section 5 - Characteristics of printed boards
Section 6 - Capability test programme
Section 7 - Quality conformance inspection
Section 8 - Test patterns - test boards
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the composite test
      patterns

Characteristics to be assessed and test methods used for capability approval testing and quality conformance inspection of boards without through connections.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS CECC23400(1990). 1992 Version incorporates amendment 7367 to BS CECC23400(1990). Supersedes 89/23561 DC and 94/216046 DC. To be read in conjunction with BS CECC23000(1989). (08/2005)
DocumentType
Standard
Pages
30
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
NEN EN 123400 : 1995 AMD 2 1995 Identical
I.S. EN 123400:1994 Identical
CECC 23400 : 1985 Identical
DIN EN 123400:1992-11 Identical
EN 123400:1992/A2:1995 Identical
SN EN 123400 : AMD 2 1995 Identical

BS CECC 123400-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections

CECC 00107(PT3) : 80 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS 9000-2(1996) : 1996 GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM
CECC 23500 : 1985 SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
CECC 00010 : 1980 AMD 1 BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
BS 6221-2:1991 Printed wiring boards Methods of test
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
CECC 00111 : 80 AMD 3 CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
BS 2011(1967) : LATEST
BS 6221-7:1982 Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections

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Hardcopy - English
PDF - English
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