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BS EN 60191-6-19:2010

Current
Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2010

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated
  temperature
7 Recommended datasheet for the package warpage
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

Committee
EPL/47
DevelopmentNote
Supersedes 08/30172909 DC. (06/2010)
DocumentType
Standard
Pages
18
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC PAS 60191-6-19:2008 Identical
IEC 60191-6-19:2010 Identical
EN 60191-6-19:2010 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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Hardcopy - English
PDF - English
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