• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

BS EN 60191-6-8:2001

Current
Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

16-11-2001

Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Committee
EPL/47
DevelopmentNote
Also numbered as IEC 60191-6-8 Supersedes 99/203696 DC (11/2001)
DocumentType
Standard
Pages
14
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
UNE-EN 60191-6-8:2002 Identical
NF EN 60191-6-8 : 2002 Identical
DIN EN 60191-6-8:2002-05 Identical
I.S. EN 60191-6-8:2002 Identical
EN 60191-6-8:2001 Identical

View more information
£120.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.