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BS EN 60249-2-3:1994

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Specifications Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Available format(s)

Hardcopy , PDF

Withdrawn date

01-10-2006

Language(s)

English

Published date

15-04-2001

Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material
   after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex
ZA (normative) Other international publications quoted
   in this standard with the references of the relevant
   European publications

In thicknesses of 0.5 mm up to 6.4 mm.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS 4584-102.3(1990). 1994 version incorporates amendment 8243 to BS 4584-102.3(1990). Also numbered as IEC 60249-2-3. Supersedes 89/22199 DC & 98/232799 DC. (09/2005)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes

IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

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