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BS EN 60512-12-7:2001

Current
Current

The latest, up-to-date edition.

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-08-2001

1 Scope and object
2 Normative references
3 Preparation of the specimen
4 Procedure
5 Final measurement
6 Requirements
7 Details to be specified
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

Specifies a standard test method to access the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

Committee
EPL/48
DevelopmentNote
Also numbered as IEC 60512-12-7. (08/2001) Supersedes 97/230402 DC (05/2005)
DocumentType
Standard
Pages
8
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 60512-12-7:2001 Identical
UNE-EN 60512-12-7:2002 Identical
I.S. EN 60512-12-7:2001 Identical
NF EN 60512-12-7 : 2002 Identical
DIN EN 60512-12-7:2001-11 Identical
SN EN 60512-12-7 : 2001 Identical

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
HD 323.2.54 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD

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