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BS EN 60749-14:2003

Current
Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-12-2003

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Committee
EPL/47
DevelopmentNote
Supersedes 02/204667 DC (12/2003) Supersedes BS EN 60749. (09/2005)
DocumentType
Standard
Pages
18
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
NBN EN 60749-14 : 2004 Identical
UNE-EN 60749-14:2004 Identical
NF EN 60749-14 : 2004 Identical
IEC 60749-14:2003 Identical
I.S. EN 60749-14:2003 Identical
DIN EN 60749-14:2004-07 Identical
EN 60068-2-13:1999 Identical
EN 60749-14:2003 Identical

IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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