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BS EN 60749-16:2003

Current
Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

24-06-2004

Publisher

British Standards Institution

Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance
8 Detail specification
9 Summary

Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Committee
EPL/47
DevelopmentNote
Partially supersedes BS EN 60749 Supersedes 00/203281 DC (07/2003)
DocumentType
Standard
Pages
10
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
UNE-EN 60749-16:2003 Identical
DIN EN 60749-16:2003-09 Identical
NBN EN 60749-16 : 2004 Identical
I.S. EN 60749-16:2003 Identical
IEC 60749-16:2003 Identical
EN 60749-16:2003 Identical
NF EN 60749-16 : 2003 Identical

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Hardcopy - English
PDF - English
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