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BS EN 60749-42:2014

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Temperature and humidity storage

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2014

1 Scope
2 Normative references
3 Test equipment
4 Procedure
5 Failure criteria
6 Information to be given in applicable
  procurement document
Annex ZA (normative) - Normative references to international
         Publications with their corresponding European
         publications

Defines a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments.

This part of IEC60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Committee
EPL/47
DevelopmentNote
Supersedes 12/30263960 DC. (10/2014)
DocumentType
Standard
Pages
12
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 60749-42:2014 Identical
IEC 60749-42:2014 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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