BS EN 60749-8:2003
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Sealing
Hardcopy , PDF
English
03-07-2003
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
3.1 Units of pressure
3.2 Standard leak rate
3.3 Measured leak rate
3.4 Equivalent standard leak rate
4 Bomb pressure test
5 Fine leak detection: radioactive krypton method
5.1 Object
5.2 General description
5.3 Personnel precautions
5.4 Procedure
5.5 Specified conditions
5.6 Gross leak detection
6 Fine leak detection: tracer gas (helium) method
with mass spectrometer
6.1 General
6.2 Method 1: specimens not filled with helium
during manufacture - Fixed method
6.3 Method 2: specimens not filled with helium
during manufacture - Flexible method
6.4 Method 3: specimens filled with helium
during manufacture
6.5 Gross leak detection
7 Gross leaks, perfluorocarbon - bubble detection method
7.1 Object
7.2 General description
7.3 Test apparatus
7.4 Test method
7.5 Reject criterion
8 Gross leak - Perfluorocarbon - bubble detection method
9 Test condition E, weight-gain gross-leak detection
9.1 Object
9.2 Equipment
9.3 Procedure
9.4 Failure criteria
10 Penetrant dye gross leak detection
11 Gross leak re-test
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
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