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EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
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IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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IEC 61249-2-7:2002
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Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
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ISO 9455-2:1993
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Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
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IEC 61189-1:1997+AMD1:2001 CSV
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IEC 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
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IEC 62137:2004
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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IEC 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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ISO 9455-1:1990
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Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
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IEC 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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IEC 61189-3:2007
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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EN 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
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ISO 5725-2:1994
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Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
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ISO 9001:2015
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Quality management systems — Requirements
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IPC 9201 : A
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SURFACE INSULATION RESISTANCE HANDBOOK
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EN 61190-1-3:2007/A1:2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
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EN 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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IPC TR 467 : 0
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SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
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IEC 61189-2:2006
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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IEC 61190-1-3:2007+AMD1:2010 CSV
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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