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BS EN 61192-4:2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies Terminal assemblies
Available format(s)

Hardcopy , PDF

Withdrawn date

08-05-2019

Language(s)

English

Published date

30-06-2003

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection technique
   4.4 Interpretation of requirements
5 Process characterization
   5.1 Wire preparation processes
   5.2 Terminal mounting processes
   5.3 Soldering terminal
   5.4 Solderability
   5.5 Preconditioning
   5.6 Mechanical securing
6 Wire preparation attributes
   6.1 Insulation stripping
   6.2 Twisted strands
7 Connector pins and terminals
   7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
   8.1 Wire selection
   8.2 Wire routing
   8.3 Staking
   8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
   10.1 Post terminations
Figures
Table

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Committee
EPL/501
DevelopmentNote
Supersedes 98/232816 DC (07/2003)
DocumentType
Standard
Pages
34
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

Standards Relationship
I.S. EN 61192-4:2003 Identical
NF EN 61192-4 : 2003 Identical
EN 61192-4:2003 Identical
NBN EN 61192-4 : 2004 Identical
IEC 61192-4:2002 Identical
DIN EN 61192-4:2003-11 Identical

IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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PDF - English
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