Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-03-2009

Publisher

British Standards Institution

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Committee	EPL/501
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
EN 62137-1-4:2009	Identical
IEC 62137-1-4:2009	Identical

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