BS EN 62137:2004

Superseded

View Superseded by

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Amendment of

BS EN 62137-4:2014

Available format(s)

Hardcopy , PDF

Superseded date

30-06-2015

Language(s)

English

Published date

13-05-2005

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviations
5 Solder joint quality test methods
   5.1 Reflow solderability test for solder joint
   5.2 Reserved for future use
6 Mechanical test methods
   6.1 Bending test for solder joint
   6.2 Drop test for solder joint
7 Environment test methods
   7.1 Temperature cycling test for solder joint
   7.2 Reserved for future use
Annex A (informative) Informative test methods for test
                      board - Guidance
Annex B (informative) Standard mounting process for area
                      array type packages and peripheral
                      terminal type packages (QFN and SON)
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications
Bibliography
Figures
Tables

Defines the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.

Committee	EPL/501
DevelopmentNote	Supersedes 01/202664 DC (11/2004)
DocumentType	Standard
Pages	30
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 62137-4:2014
Supersedes	01/202664 DC : DRAFT APRIL 2001 DD IEC/PAS 62137-3:2008

Standards	Relationship
EN 60464-2:2001	Identical
IEC 62137:2004/COR1:2005	Identical
DIN EN 62137:2005-04	Identical
NBN EN 62137 : 2005	Identical
NF EN 62137 : 2005	Identical
EN 62137:2004/corrigendum:2005	Identical
I.S. EN 62137:2005	Identical
IEC 62137:2004	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-2:2002	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60749-1:2002	Semiconductor devices - Mechanical and climatic test methods - Part 1: General
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60191-6-2:2001	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-44:1995	Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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BS EN 62137:2004

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory