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BS EN 62137-3:2012

Current
Current

The latest, up-to-date edition.

Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-03-2012

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

Committee
EPL/501
DevelopmentNote
Supersedes DD IEC PAS 62137-3 and 09/30206176 DC. (02/2012)
DocumentType
Standard
Pages
47
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62137-3:2011 Identical
EN 62137-3:2012 Identical
IEC 61310-3:2007 Identical
EN 61310-3:2008 Identical

EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
EN 62137-1-1 : 2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

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