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BS EN 62739-3:2017

Current
Current

The latest, up-to-date edition.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-04-2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Selection of the appropriate erosion test method
6 Common items for each test method
7 Overview of the test methods
Annex A (informative) - Selection of test temperature,
        test duration and bending stress
Annex B (informative) - Maximum depth and other
        measurements
Annex C (informative) - Erosion mechanism
Annex D (informative) - Thermal acceleration for
        erosion
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Explains the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee
EPL/501
DevelopmentNote
Supersedes 16/30338642 DC. (04/2017)
DocumentType
Standard
Pages
38
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62739-3:2017 Identical
EN 62739-3:2017 Identical
IEC 61869-3:2011 Identical
EN 61869-3 : 2011 Identical

IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 62739-1 : 2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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