Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-03-2019

Publisher

British Standards Institution

This part of IEC 62951 specifies the test method for thermal characteristics of flexible materials.

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

Committee	EPL/47
DocumentType	Standard
ISBN	9780580972911
Pages	18
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC 62951-5:2019	Identical

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BS IEC 62951-5:2019

Current

Abstract

Scope

General Product Information

International Equivalents

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Subcategory

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