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BS ISO 14237:2010

Current
Current

The latest, up-to-date edition.

Surface chemical analysis. Secondary-ion mass spectrometry. Determination of boron atomic concentration in silicon using uniformly doped materials
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-08-2010

Foreword
Introduction
1 Scope
2 Normative references
3 Principle
4 Reference materials
5 Apparatus
6 Specimen
7 Procedure
8 Expression of results
9 Test report
Annex A (informative) - Determination of carrier density
        in silicon wafer
Annex B (informative) - Boron isotope ratio measured by
        SIMS
Annex C (normative) - Procedures for evaluation of
        apparatus performance
Annex D (informative) - Statistical report on
        interlaboratory test programme
Bibliography

Defines a secondary-ion mass spectrometric method for the determination of boron atomic concentration in single-crystalline silicon using uniformly doped materials calibrated by a certified reference material implanted with boron.

This International Standard specifies a secondary-ion mass spectrometric method for the determination of boron atomic concentration in single-crystalline silicon using uniformly doped materials calibrated by a certified reference material implanted with boron. This method is applicable to uniformly doped boron in the concentration range from 1×1016 atoms/cm3 to 1×1020 atoms/cm3.

Committee
CII/60
DevelopmentNote
Supersedes 98/122632 DC. (05/2005) Supersedes 09/30153670 DC. (08/2010) Reviewed and confirmed by BSI, April 2016. (03/2016)
DocumentType
Standard
Pages
30
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
ISO 14237:2010 Identical

SEMI MF84:2012 TEST METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS WITH AN IN-LINE FOUR-POINT PROBE
ISO 18114:2003 Surface chemical analysis Secondary-ion mass spectrometry Determination of relative sensitivity factors from ion-implanted reference materials
SEMI MF723 : 2007E(R2012)E PRACTICE FOR CONVERSION BETWEEN RESISTIVITY AND DOPANT OR CARRIER DENSITY FOR BORON-DOPED, PHOSPHOROUS-DOPED, AND ARSENIC-DOPED SILICON
SEMI MF1392:2007 TEST METHOD FOR DETERMINING NET CARRIER DENSITY PROFILES IN SILICON WAFERS BY CAPACITANCE-VOLTAGE MEASUREMENTS WITH A MERCURY PROBE
SEMI MF95 : 2007(R2018) TEST METHOD FOR THICKNESS OF LIGHTLY DOPED SILICON EPITAXIAL LAYERS ON HEAVILY DOPED SILICON SUBSTRATES USING AN INFRARED DISPERSIVE SPECTROPHOTOMETER
SEMI MF374 :2012(R2018) TEST METHOD FOR SHEET RESISTANCE OF SILICON EPITAXIAL, DIFFUSED, POLYSILICON, AND ION-IMPLANTED LAYERS USING AN IN-LINE FOUR-POINT PROBE WITH THE SINGLE-CONFIGURATION PROCEDURE
SEMI MF110 : 2007(R2018) TEST METHOD FOR THICKNESS OF EPITAXIAL OR DIFFUSED LAYERS IN SILICON BY THE ANGLE LAPPING AND STAINING TECHNIQUE
ISO 17560:2014 Surface chemical analysis Secondary-ion mass spectrometry Method for depth profiling of boron in silicon
ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
SEMI MF672 : 2007 TEST METHOD FOR MEASURING RESISTIVITY PROFILES PERPENDICULAR TO THE SURFACE OF A SILICON WAFER USING A SPREADING RESISTANCE PROBE
SEMI MF43 : 2016 TEST METHOD FOR RESISTIVITY OF SEMICONDUCTOR MATERIALS
SEMI MF674 : 2016 PRACTICE FOR PREPARING SILICON FOR SPREADING RESISTANCE MEASUREMENTS

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