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CEI 56-44 : 2000

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
Available format(s)

Hardcopy , PDF

Withdrawn date

01-06-2021

Language(s)

English

Published date

01-01-2000

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
   screening programme
6 General information about the reliability stress
   screening process
7 Analysis of the benefits of the reliability stress
   screening process
8 Characteristics of a successful reliability stress
   screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress concerning
   process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
   stress screening process
Annex A (informative) - RSS of repairable items produced
        in lots
Annex B (informative) - RSS of electronic components

Gives a guide to reliability stress screening process for electronic hardware.

Committee
CT 56
DocumentType
Standard
Pages
38
PublisherName
Comitato Elettrotecnico Italiano
Status
Withdrawn

Standards Relationship
IEC 60300-3-7:1999 Identical

CEI 56-46 : 2005 DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods

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