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CEI CLC/TR 62258-3 : 2007

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of bare
   die and wafers
10 Good practice for automated handling during assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-54. (04/2007)
DocumentType
Standard
Pages
52
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
CLC/TR 62258-3:2007 Identical

EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
EN 61340-5-2:2001/corrigendum:2001 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN ISO 14644-1:2015 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015)

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PDF - English
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