CEI EN 60068-2-54 : 2007

Superseded

ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD

Available format(s)

Hardcopy , PDF

Superseded date

01-10-2017

Language(s)

English - Italian

Published date

01-01-2007

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. General description of the test
5. Description of the test apparatus
6. Preconditioning
7. Materials
8. Procedure
9. Presentation of results
10. Information to be given in the relevant
    specification
Annex A (normative) - Equipment specification
Annex B (informative) - Guide to the use of the
                        wetting balance for solderability
                        testing
Bibliography
Annex ZA (normative) - Normative references
                       to international publications with
                       their corresponding European
                       publications

Describes the outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-41. Supersedes CEI 50-8/1:1998. (02/2007) Superseded by CEI EN 60068-2-69 but remains current and will be withdrawn on 11-04-2020. (12/2017)
DocumentType	Standard
Pages	38
PublisherName	Comitato Elettrotecnico Italiano
Status	Superseded
SupersededBy	CEI EN 60068-2-69 : 2008
Supersedes	CEI 50-8/1 : 1ED 1998

Standards	Relationship
IEC 60068-2-54:2006	Identical
EN 60068-2-54:2006	Identical

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-44:1995	Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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CEI EN 60068-2-54 : 2007

Superseded

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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