|
IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance
|
|
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
|
|
EN 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
|
|
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
|
|
EN 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
|
|
ISO 9454-2:1998
|
Soft soldering fluxes Classification and requirements Part 2: Performance requirements
|
|
EN 60068-1:2014
|
Environmental testing - Part 1: General and guidance
|
|
EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
|
|
IEC 61760-1:2006
|
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
|
|
EN 61249-2-35:2009
|
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
|
|
EN ISO 9454-2:2000
|
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
|
|
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
|
|
EN 61249-2-22:2005
|
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
|
|
IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
|
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 61249-2-35:2008
|
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
|
|
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
|
|
IEC 61249-2-22:2005
|
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
|
|
EN 61190-1-3:2007/A1:2010
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
|
|
EN 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
|
|
EN 60194:2006
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
|
Important note : All end users must be registered with an Account prior to user licenses being assigned.