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CEI
CEI EN 60191-6-19 : 2011

CEI EN 60191-6-19 : 2011

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Sample
5. Measurement
6. Maximum permissible package warpage at
   elevated temperature
7. Recommended datasheet for the package
   warpage
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-76. (11/2011)
DocumentType
Standard
Pages
20
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60191-6-19:2010 Identical
IEC 60191-6-19:2010 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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Hardcopy - English
PDF - English
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