SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) - Normative
         references to international
         publications with their
         corresponding European
         publications

Defines various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-37. (01/2005) Supersedes CEI EN 60749. (05/2008)
DocumentType	Standard
Pages	22
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749 : 2000 AMD 2 2004

Standards	Relationship
IEC 60749-14:2003	Identical
EN 60749-14:2003	Identical

IEC 60749-8:2002	Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
EN 60749-8:2003	Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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CEI EN 60749-14 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory